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HIGH VOLTAGE CHIP CAPACITORS
1. PART NO. EXPRESSION :
V2N SERIES
V2N2R0J-B-10
(a)(b)(c) (d) (e) (f) (g)
(a) Chip Size (b) Temp. Coefficient : N ( 30ppm/C ) ( Temp. range : -55C to +125C ) (c) Capacitance code : 2R0 = 2.0pF
(d) Tolerance code (e) Voltage code : B = 200Vdc (f) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A D L G
B
C
PCB Pattern Unit:m/m
A
B
C
D
G
H
L
1.600.10 0.800.10 0.90 Max.
0.15 Min. 0.40 - 0.60 0.60 - 0.80 0.60 - 0.70
3. SCHEMATIC :
4. MATERIALS : b a
Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.)
(a) Body : Ceramic (b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION : a) Storage temp. : +5C to +40C b) Operating temp. : -55C to +125C c) Resistance to solder heat : 260C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH VOLTAGE CHIP CAPACITORS
6. ELECTRICAL CHARACTERISTICS : ( Rated Voltage : 200Vdc ) Part Number V2N2R0 -B-10 V2N3R3 -B-10 V2N3R9 -B-10 V2N5R0 -B-10 V2N8R2 -B-10 V2N100 -B-10 V2N120 -B-10 V2N150 -B-10 V2N180 -B-10 V2N220 -B-10 V2N270 -B-10 V2N330 -B-10 V2N390 -B-10 V2N470 -B-10 V2N560 -B-10 V2N680 -B-10 V2N820 -B-10 V2N101 -B-10 V2N121 -B-10 V2N151 -B-10 Tolerance code : : C : 0.25pF D : 0.50pF J : 5% K : 10% M : 20% Capacitance ( pF ) 2.0 3.3 3.9 5.0 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150
V2N SERIES
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 2
HIGH VOLTAGE CHIP CAPACITORS
7. RELIABILITY & TEST CONDITION :
V2N SERIES
ITEM
Electrical Characteristics Test Visual Insulation Resistance
PERFORMANCE
TEST CONDITION
No abnormal exterior appearance 10,000M or 500/C product whichever is smaller
Visual inspection V < 500V, Rated Voltage V > 500V, Applied 500Vdc Charge Time: 60sec is applied less than 50mA current
Capacitance
Within the specified tolerance [Class I (N) & Class II]
Class I : C < 100pF : Freq. = 1MHz10%, Voltage = 1.00.2Vrms C > 100pF : Freq. = 1KHz10% Class II : X : Freq. = 1KHz10%, Voltage = 1.00.2Vrms Z/E : Freq. = 1KHz10%, Voltage = 1.00.2Vrms Perform a heat temp. at 1505C for 30min. then place room temp. for 242hr
Q
Class I (N) : More than 30pF : Q > 1000 30pF & below : Q > 400+20C (C: Capacitance, pF)
Tan Withstanding Voltage
Class II (X) : 2.5% maximum Class II (Z/E) : 4.0% maximum No dielectric breakdown or mechanical breakdown 200V < V < 500V : 200% rated voltage 500V < V < 1000V : 150% rated voltage 1000 < V : 120% rated voltage for 1-5sec. Current is limited to less than 50mA.
* Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arching on the chip surface, at voltage over 1000Vdc.
Temperature Capacitance Coefficient
Class I : Char. N Class II : Char. X E Z Temp. Range -55C ~ +125C -30C ~ +85C +10C ~ +85C Cap. Change (%) 15% +22% ~ -56% +22% ~ -56% Temp. Range -55C ~ +125C Cap. Change (%) 30ppm/C
Class I : [C2-C1/C1(T2-T1)] x 100% Class II : (C2-C1)/C1 x 100% T1 : Standard temperature (25C) T2 : Test temperature C1 : Capacitance at standard temperature (25C) C2 : Capacitance at test temperature (T2)
Adhesive Strength of Termination
No indication of peeling shall occur on the terminal electrode
A 5N f pull force shall be applied for 101second
5N f
Resistance to Flexure of Substrate
Appearance : No mechanical damage shall be occur C-Meter : Capacitance Change
Bending shall be applied to the 1.0mm with 1.0mm/sec R230
451mm
451mm
NOTE : Specifications subject to change without notice. Please check our website for latest information.
Bending Limit
N : < 5.0% X : < 12.5% E/Z : < 30.0%
C Meter
15.01.2008
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PG. 3
HIGH VOLTAGE CHIP CAPACITORS
7. RELIABILITY & TEST CONDITION :
V2N SERIES
ITEM
Solderability
PERFORMANCE
More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve
TEST CONDITION
Solder Temp. : 2455C Dip Time : 50.5sec Immersing Speed : 2510% mm/s Solder : H63A Flux : Rosin Preheat : At 80~120C for 10~30sec Class II capacitor shall be set for 484 hrs at room temp. after 1 hr heat treatment at 150+0/-10C before initial measure. Preheat : At 15010C for 60~120sec Dip : Solder Temp. of 2605C Dip Time : 101sec Immersing speed : 2510% mm/s Solder : H63A Flux : Rosin Measure at room temp. after cooling for Class I : 242 hrs Class II : 484 hrs
Resistance to Soldering Heat
Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within 2.5% or 0.25pF whichever is larger of initial value
Class II : Char. X Z/E Capacitance change Within 10% Within 20%
Q(Class I), Tan (Class II), Insulation Resistance & Withstand Voltage : To satisfy the specified initial value Temperature Cycle Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within 2.5% or 0.25pF whichever is larger of initial value Class II capacitor shall be set for 484 hrs at room temp. after 1 hr heat treatment at 150+0/-10C before initial measure. Step 1 2 3 4 Capacitance change Within 7.5% Within 20% Temp. (C) Min. rated temp. +0/-3 25 Min. rated temp. +3/-0 25 Time (min) 30 3 30 3
Class II : Char. X/B Y/Z/E
Measure at room temp. after cooling for Class I : 242 hrs Class II : 484 hrs Solder the capacitor on P.C. board before testing
Q(Class I), Tan (Class II) & Insulation Resistance : To satisfy the specified initial value Humidity Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within 5.0% or 0.5pF whichever is larger of initial value
Class II capacitor shall be set for 484 hrs at room temp. after 1 hr heat treatment at 150+0/-10C before initial measure. Temperature : 402C Relative Humidity : 90~95% RH Test Time : 500 +12/-0 hr Measure at room temp. after cooling for Class I : 242 hrs Class II : 484 hrs Solder the capacitor on P.C. board before testing
Class II : Char. X Z/E Capacitance change Within 15% Within 30%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH VOLTAGE CHIP CAPACITORS
7. RELIABILITY & TEST CONDITION :
V2N SERIES
ITEM
Humidity
PERFORMANCE
Q(Class I) : More than 30pF : Q > 350 30pF & below : Q > 275 +2.5xC Tan X Z/E (Class II) : Maximum 5.0% 5.0%
TEST CONDITION
Class II capacitor shall be set for 484 hrs at room temp. after 1 hr heat treatment at 150+0/-10C before initial measure. Temperature : 402C Relative Humidity : 90~95% RH Test Time : 500 +12/-0 hr Measure at room temp. after cooling for Class I : 242 hrs Class II : 484 hrs Solder the capacitor on P.C. board before testing Class II capacitors applied DC voltage (following table) is applied for 1 hr at max. operation temp. 3C then shall be set for 484 hrs at room temp. and the initial measurement shall be conducted. Applied Voltage : Rated Voltage V < 250Vdc Less than 1KVdc More than 1KVdc (include 1KV) Applied Voltage 150% rated voltage 120% rated voltage 100% rated voltage
Char.
Insulation Resistance : 1,000M or 50/C whichever is smaller. High Temperature Load Appearance : No mechanical damage shall be occur Class I : Char. N Class II : Char. X Z/E Capacitance change Within 15% Within 30% Capacitance change Within 3.0% or 0.3pF whichever is larger of initial value
Q(Class I) : More than 30pF : Q > 350 30pF & below : Q > 275 +2.5xC Tan X Z/E (Class II) : Maximum 5.0% 5.0%
Temp. : Max. operation temperature Test Time : 1000 +12/-0 hr Current Applied : 50mA max. Measure at room temp. after cooling for Class I : 242 hrs Class II : 484 hrs
Char.
Insulation Resistance : 1,000M or 50/C whichever is smaller. (C in Farad) Vibration Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within 2.5% or 0.25pF whichever is larger of initial value Solder the capacitor on P.C. board before testing Vibrate the capacitor with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55 Hz and back to 10Hz in about 1min. Repeat this for 2 hrs each in 3 perpendicular directions
Class II : Char. X Z/E Capacitance change Within 7.5% Within 20%
Q(Class I), Tan (Class II) & Insulation Resistance : To satisfy the specified initial value
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH VOLTAGE CHIP CAPACITORS
8. SOLDERIND AND MOUNTING : 8-1 Re-flow Soldering :
V2N SERIES
Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack on the components. The recommended heating rate depends on the size of the component, however it should not exceed 3C/sec. 8-2 Wave Soldering : Most of the components are wave soldered with solder at 230~250C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits. 8-3 Hand Soldering : Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommend unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron. How to solder repair by solder iron : 1) Selection of soldering iron tip The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size 2) recommended solder iron condition a) Preheat substrate to (60C~120C). b) 350C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm f) Limit soldering time to 5 secs. Cooling condition : Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temp. difference between the solvent and the chips must be less than 100C.
TEMPERATURE C
TEMPERATURE C
Preheating
260 217
Soldering
Natural cooling
Preheating
300 250 230 200
Soldering
Natural cooling
Over 1min.
Over 1min.
Gradual Cooling 70-90secs
Over 2mins.
Over 1min 2-3secs.
Figure 1. Re-flow Soldering
Figure 2. Wave Soldering
TEMPERATURE C
Preheating
350 250 200
Soldering
Natural cooling
Within 5secs.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH VOLTAGE CHIP CAPACITORS
9. PACKAGING INFORMATION : 9-1. Reel Dimension
TYPE
W A
V2N SERIES
A(mm) 382 Max. 382 Max. 382 Max. 382 Max. 1780.2 1780.2 1780.2
B(mm) 50 Min. 50 Min. 50 Min. 50 Min. 600.2 600.2 600.2
C(mm) 130.5 130.5 130.5 130.5 130.5 130.5 130.5
D(mm) 210.8 210.8 210.8 210.8 210.8 210.8 210.8
E(mm) 2.00.5 2.00.5 2.00.5 2.00.5 2.00.5 2.00.5 2.00.5
W(mm) 100.15 100.15 100.15 100.15 130.3 130.3 130.3
V2 V3
E C
V4 V5 V6
D
B
V7 V8
9-2. Tape Dimension
O1.5 +0.1 -0 1.750.1 A
4.00.1
2.00.05
TYPE
3.50.05 8.00.3
Ao(mm) 1.10.2 1.50.2 1.90.2 2.90.2
Bo(mm) 1.90.2 2.30.2 3.50.2 3.60.2
Ko(mm) 1.1 MAX. 1.1 MAX. 1.1 MAX. 1.1 MAX.
P(mm) 4.00.1 4.00.1 4.00.1 4.00.1
V2
Bo
V3 V4
A
P
Ao
Ko
Section A-A
V5
O1.5 +0.1 -0 1.750.1 A
4.00.1
2.00.05
t
TYPE
12.00.3 5.50.05
Ao(mm) 2.50.2 3.60.2 5.40.2
Bo(mm) 4.90.2 4.90.2 6.10.2
Ko(mm) 4.0 MAX. 4.0 MAX. 4.0 MAX.
P(mm) 4.00.1 4.00.1 4.00.1
t(mm) 0.3 MAX. 0.3 MAX. 0.3 MAX.
V6
Bo
V7
Ko
A 1.50.1
P
Ao
V8
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH VOLTAGE CHIP CAPACITORS
V2N SERIES
9-3. Packaging Quantity
V2 / V3 Tape Mat'l Paper Plastic T<0.90mm 4000pcs/reel T>0.90mm 3000pcs/reel T<0.90mm 4000pcs/reel V4 0.90mm1.25mm 2000pcs/reel
V5 / V6 Tape Mat'l Paper Plastic T<1.25mm 3000pcs/reel T>1.25mm 2000pcs/reel
V7 / V8 T<2.20mm 1000pcs/reel T>2.20mm 700pcs/reel T : Chip Thickness
9-4. Tearing Off Force F
165 to 180
Top cover tape Base tape
The force for tearing off cover tape is 5 to 70 grams in the arrow direction under the following conditions.
Storage
Store the capacitors where the temp. and relative humidity do not exceed 40C and 70%RH. Capacitors are recommended to be used within 6 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8

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